中英文对照PCB生产流程常用术语由刀豆文库小编整理，希望给你工作、学习、生活带来方便，猜你可能喜欢“pcb术语中英文对照”。
中英文对照PCB生产流程常用术语
A.开料(Cut Lamination)
a-1 裁板(Sheets Cutting)
a-2 原物料发料(Panel)(Shear material to Size)
B.钻孔(Drilling)
b-1 内钻(Inner Layer Drilling)
b-2 一次孔(Outer Layer Drilling)
b-3 二次孔(2nd Drilling)
b-4 雷射钻孔(Laser Drilling)(Laser Ablation)b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)
C.干膜制程(Photo Proce(D/F))
c-1 前处理(Pretreatment)
c-2 压膜(Dry Film Lamination)
c-3 曝光(Exposure)
c-4 显影(Developing)
c-5 蚀铜(Etching)
c-6 去膜(Stripping)
c-7 初检(Touch-up)
c-8 化学前处理,化学研磨(Chemical Milling)
c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing)
c-11 去膜(Stripping)
Developing , Etching & Stripping(DES)
D.压合Lamination
d-1 黑化(Black Oxide Treatment)
d-2 微蚀(Microetching)
d-3 铆钉组合(eyelet)
d-4 叠板(Lay up)
d-5 压合(Lamination)
d-6 后处理(Post Treatment)
d-7 黑氧化(Black Oxide Removal)
d-8 铣靶(spot face)
d-9 去溢胶(resin flush removal)
E.减铜(Copper Reduction)
e-1 薄化铜(Copper Reduction)
F.电镀(Horizontal Electrolytic Plating)
f-1 水平电镀(Horizontal Electro-Plating)(Panel Plating)
f-2 锡铅电镀(Tin-Lead Plating)(Pattern Plating)
f-3 低于1 mil(Le than 1 mil Thickne)
f-4 高于1 mil(More than 1 mil Thickne)
f-5 砂带研磨(Belt Sanding)
f-6 剥锡铅(Tin-Lead Stripping)
f-7 微切片(Microsection)
G.塞孔(Plug Hole)
g-1 印刷(Ink Print)
g-2 预烤(Precure)
g-3 表面刷磨(Scrub)
g-4 后烘烤(Postcure)
H.防焊(绿漆/绿油):(Solder Mask)
h-1 C面印刷(Printing Top Side)
h-2 S面印刷(Printing Bottom Side)
h-3 静电喷涂(Spray Coating)
h-4 前处理(Pretreatment)
h-5 预烤(Precure)
h-6 曝光(Exposure)
h-7 显影(Develop)
h-8 后烘烤(Postcure)
h-9 UV烘烤(UV Cure)
h-10 文字印刷(Printing of Legend)
h-11 喷砂(Pumice)(Wet Blasting)
h-12 印可剥离防焊(Peelable Solder Mask)
I.镀金Gold plating
i-1 金手指镀镍金(Gold Finger)
i-2 电镀软金(Soft Ni/Au Plating)
i-3 浸镍金(Immersion Ni/Au)(Electrole Ni/Au)
J.喷锡(Hot Air Solder Leveling)
j-1 水平喷锡(Horizontal Hot Air Solder Leveling)
j-2 垂直喷锡(Vertical Hot Air Solder Leveling)
j-3 超级焊锡(Super Solder)
j-4.印焊锡突点(Solder Bump)
K.成型(Profile)(Form)
k-1 锣边(N/C Routing)(Milling)
k-2 模具冲(Punch)
k-3 板面清洗烘烤(Cleaning & Backing)
k-4 V型槽(V-Cut)(V-Scoring)
k-5 金手指斜边(Beveling of G/F)
L.开短路测试(Electrical Testing)(Continuity & Insulation Testing)l-1 AOI 光学检查(AOI Inspection)
l-2 VRS 目检(Verified & Repaired)
l-3 泛用型治具测试(Universal Tester)
l-4 专用治具测试(Dedicated Tester)
l-5 飞针测试(Flying Probe)
M.终检(Final Visual Inspection)
m-1 压板翘(Warpage Remove)
m-2 X-OUT 印刷(X-Out Marking)
m-3 包装及出货(Packing & shipping)
m-4 目检(Visual Inspection)
m-5 清洗及烘烤(Final Clean & Baking)
m-6 护铜剂(ENTEK Cu-106A)(OSP)
m-7 离子残余量测试(Ionic Contamination Test)(Cleanline Test)m-8 冷热冲击试验(Thermal cycling Testing)
m-9 焊锡性试验(Solderability Testing)
N.雷射钻孔(Laser Ablation)
N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)
N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)
N-4 雷射钻孔(Laser Ablation)
N-5 AOI 检查及VRS(AOI Inspection & Verified & Repaired)N-6 Blaser AOI(after Desmear and Microetching)
N-7 除胶渣(Desmear)
N-8 微蚀(Microetching)
